MSI's Electroless Gold plating provides a pure gold coating
solution for microelectronic applications and non-conductive substrates. It
has excellent wire bondability, solderability and eutectic die attach properties.
Usually designed for use with an electroless nickel or copper undercoat this
autocatalytic immersion process can deposit a uniform layer over complex surfaces.
processes
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continuous
reel to reel |
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automated
barrel |
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barrel/vibra-barrel
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rack |
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