MSI's Tin-Reflow plating process reduces the internal stresses that are believed to contribute to the growth of Tin Whiskers.

After plating a product with matte tin, the product is then processed through a fluxing agent followed by a series of heat cycles. It is heated to just above the liquidus state (only the tin layer reflows), and is quenched to quickly bring the Tin back to a solid state, thereby greatly reducing Tin’s natural tendency to whisker.